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D10650-40 Datasheet, PDF (5/20 Pages) List of Unclassifed Manufacturers – BGA THERMAL SOLUTIONS MATRIX
Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
660 SERIES Unidirectional Fin Heat Sink for BGAs
Standard
P/N
Base Dimensions
in. (mm)
Height
in. (mm)
660-29AB
1.530SQ. (38.9)SQ.
0.285 (7.2)
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3
Typical
Application
37mm BGA
Heat Sink
Finish
Black Anodized
Weight
lbs. (grams)
0.031 (14.17)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
642 SERIES Unidirectional Fin Heat Sink for BGAs
Standard
P/N
Base Dimensions
in. Sq.
Fin Height "A"
in. (mm)
Typical
Applications
Weight
lbs. (grams)
642-25AB
642-35AB
642-45AB
642-60AB
1.378 (35)
1.378 (35)
1.378 (35)
1.378 (35)
.250 (6.4)
.350 (8.9)
.450 (11.4)
.600 (15.2)
35 mm BGA
35 mm BGA
35 mm BGA
35 mm BGA
.022 (9.99)
.027 (12.26)
.031 (14.07)
.039 (17.71)
Material: Aluminum, Black Anodized
The 642 Series is an unidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and global
positioning systems (GPS).
PRODUCT FEATURES
• Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch.
• Available with pressure sensitive adhesives for quick and easy mounting.
See Page 3
MECHANICAL DIMENSIONS
642 SERIES
Dimensions: in. (mm)
6
642 THERMAL PERFORMANCE
14
642-25-T4
642-35-T4
12
642-45-T4
642-60-T4
10
8
6
4
2
0
200
300
400
500
600
Approach Velocity, LFM
Performance shown is with T4 thermal adhesive applied.