D10650-40 Datasheet, PDF (10/20 Pages) List of Unclassifed Manufacturers – BGA THERMAL SOLUTIONS MATRIX

Integrated Circuit
Heat Sinks
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
609 SERIES ^{Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC™ Packages}
Standard
P/N
Base Dimensions
in. (mm)
Dimensions “A”
in. (mm)
609-50AB
609-100AB
2.895 (73.5) x 2.000 (50.8)
2.808 (71.32) x 1.700 (43.2)
0.500 (12.7)
1.00 (25.4)
Note: Optional factory preapplied thermal interface material.
S3 (Bergquist Q-Pad 3, 0.14 °C in²/w)
S4 (Bergquist Softface, 0.07 °C in²/w)
Typical
Applications
40&45mm BGA
40&45mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Weight
lbs. (grams)
0.094 (42.5)
0.130 (59.0)
MECHANICAL DIMENSIONS
2.808
(609-50AB)
“A”
DIM.
(609-100AB)
FORCED CONVECTION THERMAL PERFORMANCE DATA
(FLOW PARALLEL TO EXTRUSION DIRECTION)
5
4
609-50AB
3
* ^609-100AB
2
1
0
100
200
300
400
500
AIR VELOCITY (LFM)
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
609-50AB HEAT SINK
AND CLIP ASSEMBLY
Dimensions: in. (mm)
Designed to fit a .063” thick PCB
electronic package thickness of .110”
619 SERIES ^{Fan Heat Sink for BGA and PowerPC™ Packages}
Standard
P/N
Base Dimensions
in. (mm)
Height
in. (mm)
Typical
Applications
Heat Sink
Finish
61995AB124D1 2.871 (72.92) x 1.98 (50.29)
61995AB054D1 2.871 (72.92) x 1.98 (50.29)
0.953 (24.21)
0.953 (24.21)
40&45mm BGA
40&45mm BGA
Black Anodized
Black Anodized
Note: Optional factory preapplied thermal interface material. See 609 series.
FEATURES AND BENEFITS:
• Captivated clips for ease of assembly
• Low acoustic noise
• Impingement air flow
• Accommodates BGA packages up to 45 mm in size
Thermal
Performance
1.2° C/W
1.2° C/W
Weight
lbs. (grams)
.150 (68.10)
.150 (68.10)
MECHANICAL DIMENSIONS
Dimensions: in.
See 609 Series for PCB hole layout for clip attachment
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