D10650-40 Datasheet, PDF (20/20 Pages) List of Unclassifed Manufacturers – BGA THERMAL SOLUTIONS MATRIX

Integrated Circuit
Heat Sinks
HEAT SINKS FOR MICROPROCESSORS AND ASICs
649 SERIES SpiderClip™ Heat Sink Assembly for Motorola MC68040™, MC68060
Standard
P/N
649-33AB
649-51AB
Base Dimensions
in. (mm)
1.70 (43.2) sq
1.86 (47.2) sq
Height
in. (mm)
0.315 (8.0)
0.510 (13.0)
Base Thickness
in. (mm)
0.090 (2.3)
0.090 (2.3)
Clip
Color
Gray
Gray
Heat Sink
Finish
Black Anodized
Black Anodized
18 x 18 PGA
Weight
lbs. (grams)
0.044 (19.84)
0.056 (25.51)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
649-33AB SPIDERCLIP™
Dimensions: in. (mm)
ASSEMBLY
649-51AB SPIDERCLIP™
ASSEMBLY
MECHANICAL
DIMENSIONS
669 SERIES ^{SpiderClip™ Heat Sink Assembly for IntelDX4™, AMD AM486DX2, and AM486DX4}
661 SERIES ^{Heat Sink without clip}
Standard
P/N
Base Dimensions
in. (mm)
Dimensions “A”
Height
in. (mm)
Base
Thickness
in. (mm)
Clip
Color
Standard
Finish
669-32AG
669-33AB
669-40AB
669-52AB
661-32AG
661-33AB
661-40AB
661-52AB
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
0.315 (8.0)
0.315 (8.0)
0.400 (10.2)
0.520 (13.2)
0.315 (8.0)
0.315 (8.0)
0.400 (10.2)
0.520 (13.2)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
Black
Black
Black
Black
N/A
N/A
N/A
N/A
Gold Iridite
Black Anodized
Black Anodized
Black Anodized
Gold Iridite
Black Anodized
Black Anodized
Black Anodized
17 x 17 SPGA
Weight
lbs. (grams)
0.044 (19.84)
0.044 (19.84)
0.044 (19.84)
0.050 (22.68)
0.044 (19.84)
0.044 (19.84)
0.044 (19.84)
0.050 (22.68)
669 Series SpiderClip™ Heat Sink Assemblies may be applied to the following:
• Intel 80486DX and 80486DX2™ (168 PGA)
• AMD AM 29000 Microcontrollers
• Intel 82495 Cache Controller
• Intel 80486SX (168 PGA) and I860XR (208 PGA)
• Intel I960CA, I960CF Enbedded Controllers
• Intel DX4™ (168 PGA)
• AMD AM 486 Microprocessors AM486DX2, AM486DX4
669-32AG
669-33AB
669-40AB
669-52AB
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions:
in. (mm)
669-32AG SPIDERCLIP™
ASSEMBLY
669-52AB SPIDERCLIP™
ASSEMBLY
Dielectric Breakdown (Nylon Clip Coating)
Dielectric Strength: 100 VDC/mil
Breakdown Voltage: 200 VDC (minimum)
KEY:
Ë¿ 669-32AG 0.315 (8.0) Pin Height, low density pin pattern
̆ 669-33AB 0.315 (8.0) Pin Height, high density pin pattern
v 669-40AB 0.400 (10.2) Pin Height, high density pin pattern
࡯ 669-52AB 0.520 (13.2) Pin Height, high density pin pattern
21