DS_FT230X Datasheet, PDF (39/44 Pages) List of Unclassifed Manufacturers – Future Technology Devices International Ltd

FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
9.5 Solder Reflow Profile
The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
T_p
T_L
T_S Max
T_S Min
Ramp Up
t_S
Preheat
t_p
t_L
Critical Zone: when
T is in the range
T_L to Tp
Ramp
Down
25
T = 25º C to T_P
Time, t (seconds)
Figure 9.5 FT230X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT230X is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak Temperature
(tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
Table 9.1 Reflow Profile Parameter Values
8 minutes Max.
6 minutes Max.
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