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| DS_FT230X Datasheet, PDF (37/44 Pages) List of Unclassifed Manufacturers – Future Technology Devices International Ltd | |||
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FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
9.3 QFN-16 Package Mechanical Dimensions
Figure 9.3 QFN-16 Package Dimensions
The FT230XQ is supplied in a RoHS compliant leadless QFN-16 package. The package is lead (Pb) free,
and uses a âgreenâ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.65mm pitch. The above
mechanical drawing shows the QFN-16 package. All dimensions are in millimetres.
The centre pad on the base of the FT230XQ is internally connected to ground.
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Copyright © 2013 Future Technology Devices International Limited
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