DS_FT230X Datasheet, PDF (35/44 Pages) List of Unclassifed Manufacturers – Future Technology Devices International Ltd

9 Package Parameters
FT230X USB TO BASIC UART IC
Version 1.2
Document No.: FT_000566 Clearance No.: FTDI# 260
The FT230X is available in two different packages. The FT230XS is the SSOP-16 option and the FT230XQ
is the QFN-16 package option. The solder reflow profile for both packages is described in Section 9.4.
9.1 SSOP-16 Package Mechanical Dimensions
Figure 9.1 SSOP-16 Package Dimensions
The FT230XS is supplied in a RoHS compliant 16 pin SSOP package. The package is lead (Pb) free and
uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The pins are on a
0.635 mm pitch. The above mechanical drawing shows the SSOP-16 package.
Copyright © 2013 Future Technology Devices International Limited
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