CM-IMX53 Datasheet, PDF (28/31 Pages) List of Unclassifed Manufacturers – Smart Mobile Devices

Hardware User Manual - CM-i.MX53
9 Dependability
Last change: 10 April 2013
Version 2.3
9.1 MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last
before failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take
all the components into account. The PCB and solder connections are excluded from this estimation. For
test conditions we assume an ambient temperature of 30°C of all Core Module components except the i.MX
processor (80°C) and the memories (70°C). We use the MTBF Calculator from ALD
(http://www.aldservice.com/) and use the reliability prediction MIL-217F2 Part Stress standard. Please get in
touch with Bluetechnix ([e-mail]) if you are interested in the MTBF result.
© Bluetechnix 2013
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