CM-IMX53 Datasheet, PDF (13/31 Pages) List of Unclassifed Manufacturers – Smart Mobile Devices

Hardware User Manual - CM-i.MX53
Last change: 10 April 2013
Version 2.3
addition the die temperature should be monitored regularly, so that the CPU and RAM clock can be throttled
if necessary.
3.1.3 Power Outputs
Symbol
P_LDO1_1V3
P_LDO2_1V3
P_LDO3_1V8
P_LDO4_2V8
P_SW1_1V2
P_SW2_1V3
P_SW3_2V5
P_SW4_3V3
P_ANA_PLL_1V8
VA_ETH
Description
Supply voltage for the Ethernet chokes
Table 6: Power Outputs
U [V]
1.3
1.3
1.8
2.8
1.2
1.3
2.5
3.3
1.8
3.3
Imax1 [mA]
10
120
200
50
10
200
250
300
50
10
1 _{Imax, an overstepping of this maximal current may cause permanent damage of the CM}
The voltage levels and currents are only correct with the Bluetechnix default PMIC settings.
3.1.4 ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can
discharge without detection. Although this product features patented or proprietary
protection circuitry, damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid performance degradation
or loss of functionality.
3.1.5 Cooling
If the core module is subject to high performance applications a passive or active cooling system should be
planned to prevent damage to and guarantee the full functionality of the core module. The requirement of a
cooling system depends also from the ambient temperature.
Following test was performed in a conditioning cabinet:
Firmware
- 1GHz Core clock
- 400MHz DDR2 clock
- Linux kernel running following tasks contemporaneously:
o Audio test: record and play in a loop
o GPU test: es11ex executed (high current consumption)
o DDR2 memory test: linux memtest program, write/read 175MByte in a loop
o NAND flash test: write/read with file system jffs2
o SPI flash test: write/read with file system jffs2
o USB test: write/read on USB stick with file system ext3
© Bluetechnix 2013
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