CM-IMX53 Datasheet, PDF (12/31 Pages) List of Unclassifed Manufacturers – Smart Mobile Devices

Hardware User Manual - CM-i.MX53
3 Specifications
Last change: 10 April 2013
Version 2.3
3.1 Electrical Specifications
3.1.1 Operating Conditions
Symbol
VIN
IIN1
VOH
VOL
IIH4
IOZ
IDEEPSLEEP
ISLEEP
IIDLE
I400
IHIBERNATE
IRTC
fCCLKC
fCCLKI
Parameter
Input supply voltage
Input supply current @ VIN=5.0V, TAMB=25°C
High level output voltage
Low level output voltage
IO input current
Three state leakage current
VIN current in deep sleep mode
VIN current in sleep mode
VIN current in deep sleep mode
VIN current in with core running at 400 MHz
VIN current in hibernate state
VRTC current
Core clock frequency for industrial grade
modules
Core clock frequency for commercial grade
modules
Min
3.25
TBD¹
0.7*OVDD
Typical
5.0
250²
2
TBD
TBD
TBD
TBD
TBD
TBD
Table 4: Electrical characteristics
Max
5.5
2000³
0.3*OVDD
161
1
800
1000
Unit
V
mA
V
V
µA
µA
mA
mA
mA
mA
mA
mA
MHz
MHz
OVDD=Voltage Level look at section 4.
1 _{Linux running in idle mode; TBD}
2 _{Linux writes file to SATA HDD; one USB devices plugged in; display output on HDMI interface; TBD}
3 _{Linux performing RAM Test; TBD}
4 _{Dependent on which internal Pull-up resistor is asserted}
3.1.2 Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent
damage to the device. These are stress ratings only. Operation of the device at these or any other conditions
greater than those indicated in the operating sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Symbol
VIO
VIN
IOH /IOL
TAMBI
TAMBC
TSTO
φAMB
Parameter
Min
Input or output voltage
-0.5
Input supply voltage
-0.3
Current per pin
Ambient temperature for industrial grade modules
-40
Ambient temperature for commercial grade modules 0
Storage temperature
-55
Relative ambient humidity
Table 5: Absolute maximum ratings
Max
Unit
OVDD+0.3 V
6
V
10
mA
85¹
°C
70¹
°C
150
°C
90
%
1 _{If extreme high ambient temperatures are expected (75°C in industrial environments or 60°C for commercial}
products), the user has to apply a heat dissipator on CPU and DDR-RAM (avoid heat accumulation!). In
© Bluetechnix 2013
Page | 11