MMC3316XMT Datasheet, PDF (12/13 Pages) List of Unclassifed Manufacturers – The MMC3316xMT is a complete 3-axis magnetic sensor with on-chip signal processing and integrated I2C bus.

STORAGE CONDITIONS
Temperature: <30℃
Humidity:
<60%RH
Period:
1 year (after delivery)
Moisture Sensitivity Level: 3
Bake Prior to Reflow: storage period more than 1 year, or humidity indicator card reads >60% at 23±5℃
Bake Procedure:
refer to J-STD-033
Bake to Soldering:
<1 week under 30℃/60%RH condition
SOLDERING RECOMMENDATIONS
MEMSIC magnetic sensor is capable of withstanding an MSL3 / 260℃ solder reflow. Following is the reflow profile:
300
260℃Peak Temperature For 10s 260Max
250
Max Gradient 2.8℃/s
200
195
180
180
150
100
100
50 ₅₀
0
0
50
100
150
200
250
300
350
400
450
Time(s)
Note:
 Reflow is limited by 2 times
 The second reflow cycle should be applied after device has cooled down to 25℃ (room temperature)
 This is the reflow profile for Pb free process
 The peak temperature on the sensor surface should be limited under 260℃ for 10 seconds.
 Solder paste‟s reflow recommendation can be followed to get the best SMT quality.
If the part is mounted manually, please ensure the temperature could not exceed 260℃ for 10 seconds.
MEMSIC MMC3316xMT Rev.A
Page 12 of 13
8/10/2012