W78E365 Datasheet, PDF (33/40 Pages) Winbond – 8-BIT MICROCONTROLLER

W78E365
9.2 Expanded External Data Memory and Oscillator
VDD
10 u
8.2 K
OSCILLATOR
VDD
31
19
EA
XTAL1
18 XTAL2
9 _RST
12 INT0
13 _INT1
14
15
T0
T1
1 _P1.0
2 _P1.1
3 _P1.2
4 _P1.3
5 _P1.4
6 _P1.5
7 _P1.6
8 _P1.7
W78E58B
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
RD
WR
PSEN
ALE
TXD
RXD
39 AD0
38 AD1
37 AD2
36 AD3
35 AD4
34 AD5
33 AD6
32 AD7
21 A8
22 A9
23 A10
24 A11
25 A12
26 A13
27 A14
28
17
16
29
30
11
10
AD0 3 _D0
AD1 4
AD2 7
AD3 8
AD4 13
D1
D2
D3
D4
AD5 14 _D5
AD6 17
AD7 18
D6
D7
GND _{1 OC}
11 G
Q0
Q1
2
5
A0
A1
Q2
Q3
6
9
A2
A3
Q4 ^{12 A4}
Q5
Q6
15
16
A5
A6
Q7 ^{19 A7}
74LS373
A0 10
A0
A1 9
A1
A2 8
A2
A3 7
A3
A4 6
A4
A5 5
A5
A6 4
A6
A7 3
A7
A8 25
A8
A9 24
A9
A10 21
A11 23
A12 2
A13 26
A14 1
A10
A11
A12
A13
A14
GND 20 CE
22 _OE
27
WR
20256
D0 ¹¹
AD0
D1 ¹²
AD1
D2 ¹³
AD2
D3 ¹⁵
D4 ¹⁶
AD3
AD4
D5 ¹⁷
AD5
D6 ¹⁸
AD6
D7 ¹⁹
AD7
10. PACKAGE DIMENSIONS
10.1 40-pin DIP
Figure B
40
E1
1
S
A A2
L
D
B
e1
B1
21
20
E
A1
Base Plane
Seating Plane
a
eA
Symbol ^{Dimension in inch Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.334
A1
0.010
0.254
A2
0.150 0.155 0.160 3.81 3.937 4.064
B
0.016 0.018 0.022 0.406 0.457 0.559
B1
0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E
0.590 0.600 0.610 14.986 15.24 15.494
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mo.ld parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
- 33 -
Publication Release Date: April 20, 2005
Revision A5