Si5321 Datasheet, PDF (32/34 Pages) List of Unclassifed Manufacturers – SONET/SDH PRECISION CLOCK MULTIPLIER IC

Si5321
6. 9x9 mm CBGA Card Layout
Placement Courtyard
Table 12. Recommended Land Pattern Dimensions
Symbol
Parameter
Dimension
Notes
Min
Nom
Max
C
Column Width
—
7.00 REF
—
D
Row Height
—
7.00 REF
—
E
Pad Pitch
—
1.00 BSC
—
F
Placement Courtyard
10.00
—
—
1
X
Pad Diameter
0.64
0.68
0.72
2, 3
Notes:
1. The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.
2. Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).
3. OSP Surface Finish Recommended.
4. Controlling dimension is millimeters.
5. Land Pad Dimensions comply with IPC-SM-782 guidelines.
6. Target solder paste volume per pad is 0.065 mm3 ± 0.010 mm3 (4000 mils³ ± 600 mils³).
Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191 mm
thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.
7. Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.
32
Rev. 2.3