WCMA2008U1B Datasheet, PDF (3/11 Pages) List of Unclassifed Manufacturers – 256K x 8 Static RAM

WCMA2008U1B
Electrical Characteristics Over the Operating Range
Param-
eter
Description
Test Conditions
V_{O H}
Output HIGH Voltage I_OH = –1.0 mA V_CC = 2.7V
V_{O L}
Output LOW Voltage I_OL = 2.1 mA
V_CC = 2.7V
V_IH
Input HIGH Voltage
V_IL
Input LOW Voltage
I_IX
Input Leakage Current GND < V_I < V_CC
I_OZ
Output Leakage Current GND < V_O < V_CC, Output Disabled
I_CC
V_CC Operating Supply
f =f_MAX = 1/t_RC V_CC = 3.3V
Current
f = 1 MHz
I_OUT = 0 mA
CMOS Levels
I_SB1
Automatic CE
CE₁ > V_CC – 0.2V or CE₂ < 0.2V
Power-Down Current — V_IN > V_CC – 0.2V or V_IN < 0.2V,
CMOS Inputs
f = f_max (Address and Data Only),
f = 0 (OE,WE)
I_SB2
Automatic CE
CE₁ > V_CC – 0.2V or CE₂ < 0.2V
Power-Down Current— V_IN > V_CC − 0.2V or V_IN < 0.2V,
CMOS Inputs
f = 0, V_CC=3.3V
WCMA2008U1B-70
Min.
2.4
2.2
–0.3
–1
–1
Typ. ^[2]
Max.
Unit
V
0.4
V
V_CC + 0.3V
V
0.8
V
+1
µA
+1
µA
7
15
mA
1.5
3
2
10
µA
Capacitance^[3]
Parameter
Description
Test Conditions
Max.
Unit
C_IN
C_OUT
Input Capacitance
T_A = 25°C, f = 1 MHz,V_CC = Vcc_(typ)
6
pF
Output Capacitance
8
pF
Thermal Resistance
Description
Thermal Resistance^[3]
(Junction to Ambient)
Thermal Resistance^[3]
(Junction to Case)
Test Conditions
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer print-
ed circuit board
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
Symbol
Θ_JA
Θ_{J C}
BGA
55
16
Unit
°C/W
°C/W
3