PC7410 Datasheet, PDF (12/57 Pages) ATMEL Corporation – PowerPC 7410 RISC Microprocessor Product Specification

PC7410
7. Thermal Characteristics
7.1 Package Characteristics
Table 7-1. Package Thermal Characteristics CBGA
Symbol Characteristic
Value
PC7410 CBGA Unit
R_θJA
R_θJMA
R_θJMA
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board⁽¹⁾⁽²⁾
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board⁽¹⁾⁽³⁾
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board⁽¹⁾⁽³⁾
24
° C/W
17
° C/W
18
° C/W
R_θJMA
R_θJMA
Junction-to-ambient thermal resistance, 400 ft/min airflow, single-layer (1s) board
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board⁽¹⁾⁽³⁾
16
° C/W
14
° C/W
R_θJMA
R_θJB
R_θJC
Junction-to-ambient thermal resistance, 400 ft/min airflow, four-layer (2s2p) board
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-case thermal resistance⁽⁵⁾
13
8
< 0.1
° C/W
° C/W
° C/W
Notes: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of R_θJC for the part is less than 0.1°C/W.
7.1.1
See “Thermal Management Information” on page 13 for more details about thermal management.
The board designer can choose between several commercially available heat sink types to place on the
PC7410. For exposed-die packaging technology as in Table 7-1, the intrinsic conduction thermal resis-
tance paths are shown in Figure 7-1 on page 13.
Package Thermal Characteristics for HiTCE
Table 7-2 provides the package thermal characteristics for the PC7410, HiTCE.
Table 7-2. Package Thermal Characteristics for HiTCE Package
Characteristic
Junction-to-bottom of balls⁽¹⁾
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board⁽¹⁾⁽²⁾
Symbol
Rθ_J
Rθ_JMA
Junction to board thermal resistance
Rθ_JB
Notes: 1. Simulation, no convection air flow.
2. Per JEDEC JESD51-6 with the board horizontal.
Value
PC7410 HiTCE
6.8
20.7
11.0
Unit
° C/W
° C/W
° C/W
12
0832F–HIREL–02/07
e2v semiconductors SAS 2007