HX6356 Datasheet, PDF (10/12 Pages) List of Unclassifed Manufacturers – 32K x 8 STATIC RAM-SOI

HX6356
PACKAGING
The 32K x 8 SRAM is offered in two custom 36-lead flat
36-LEAD FP PINOUT
packs (FP). The packages are constructed of multilayer
ceramic (Al₂O₃) and feature internal power and ground
planes. The 36-lead flat packs also feature a non-conduc-
tive ceramic tie bar on the lead frame. The tie bar allows
VSS
1
electrical testing of the device, while preserving the lead
VDD
2
A14
3
integrity during shipping and handling, up to the point of
A12
4
lead forming and insertion.
A7
5
A6
6
A5
7
A4
8
On the bottom braze 36-lead FP, ceramic chip capacitors
A3
9
A2
10
can be mounted to the package by the user to maximize
A1
11
supply noise decoupling and increase board packing den-
A0
DQ0
12
13
sity. These capacitors attach directly to the internal pack-
DQ1
14
DQ2
15
age power and ground planes. This design minimizes
NC
16
VDD
resistance and inductance of the bond wire and package.
VSS
17
18
Top
View
36
VSS
35
VDD
34
NWE
33
CE
32
A13
31
A8
30
A9
29
A11
28
NOE
27
A10
26
NCS
25
DQ7
24
DQ6
23
DQ5
22
DQ4
21
DQ3
20
VDD
19
VSS
All NC (no connect) pins should be connected to VSS to
prevent charge build up in the radiation environment.
36-LEAD FLAT PACK—Bottom Braze (22018131-001)
E
1
22018131-001
Top
View
H
J
L
Ceramic
Body
A
L
Kovar
Lid [3]
I
C
X
Optional
N
VSS
VDD
Capacitors VDD _VSS
Y
1
O
V
W
T
P
U
R
10
b
(width)
e
(pitch)
Non-
Conductive
Tie-Bar
0.004
M
All dimensions are in inches [1]
A 0.095 ± 0.014
M 0.008 ± 0.003
S
b 0.008 ± 0.002
N 0.050 ± 0.010
C 0.005 to 0.0075 O 0.090 ref
D 0.650 ± 0.010
P 0.015 ref
E 0.630 ± 0.007
R 0.075 ref
e 0.025 ± 0.002 [2] S 0.113 ± 0.010
F 0.425 ± 0.005 [2] T 0.050 ref
G 0.525 ± 0.005
U 0.030 ref
H 0.135 ± 0.005
V 0.080 ref
I 0.030 ± 0.005
W 0.005 ref
J 0.080 typ.
X 0.450 ref
L 0.285 ± 0.015
Y 0.400 ref
[1] Parts delivered with leads unformed
[2] At tie bar
[3] Lid tied to VSS