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M12L64164A_09 Datasheet, PDF (4/45 Pages) Elite Semiconductor Memory Technology Inc. – 1M x 16 Bit x 4 Banks Synchronous DRAM
ESMT
M12L64164A
DC CHARACTERISTICS
Recommended operating condition unless otherwise noted,TA = 0 to 70 °C
PARAMETER
SYMBOL
TEST CONDITION
VERSION
-5 -6 -7
Operating Current
(One Bank Active)
ICC1
Precharge Standby Current ICC2P
in power-down mode
ICC2PS
Burst Length = 1, tRC ≥ tRC(min), IOL = 0 mA,
tcc = tcc(min)
CKE ≤ VIL(max), tcc = tcc(min)
CKE & CLK ≤ VIL(max), tcc = ∞
100 85 85
2
1
ICC2N
CKE ≥ VIH(min), CS ≥ VIH(min), tcc = tcc(min)
20
Input signals are changed one time during 2CLK
Precharge Standby Current
in non power-down mode
ICC2NS
CKE ≥ VIH(min), CLK ≤ VIL(max), tcc = ∞
input signals are stable
10
Active Standby Current
ICC3P
CKE ≤ VIL(max), tcc = tcc(min)
10
in power-down mode
ICC3PS
CKE & CLK ≤ VIL(max), tcc = ∞
10
CKE ≥ VIH(min), CS ≥ VIH(min), tCC=15ns
Active Standby Current
ICC3N
Input signals are changed one time during 2clks
30
in non power-down mode
All other pins ≥ VDD-0.2V or ≤ 0.2V
(One Bank Active)
ICC3NS
CKE ≥ VIH(min), CLK ≤ VIL(max), tcc = ∞
input signals are stable
25
Operating Current
(Burst Mode)
Refresh Current
Self Refresh Current
ICC4
IOL = 0 mA, Page Burst, All Bank active
Burst Length = 4, CAS Latency = 3
ICC5
tRFC ≥ tRFC(min), tCC = tcc(min)
ICC6
CKE ≤ 0.2V
180 150 140
180 150 140
1
UNIT NOTE
mA
1,2
mA
mA
mA
mA
mA
mA 1,2
mA
mA
Note : 1. Measured with outputs open.
2. Input signals are changed one time during 2 CLKS.
Elite Semiconductor Memory Technology Inc.
Publication Date: May 2009
Revision: 3.4
4/45