K164 Datasheet, PDF (25/30 Pages) Siemens Semiconductor Group – Temperaturmessung Bedrahtete Scheiben

Temperature measurement and compensation
Leaded NTC thermistors, lead spacing 5 mm
B57164K
K164
8
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
c) Component orientation
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Please read Cautions and warnings and
Important notes at the end of this document.
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