K164 Datasheet, PDF (22/30 Pages) Siemens Semiconductor Group – Temperaturmessung Bedrahtete Scheiben

Temperature measurement and compensation
Leaded NTC thermistors, lead spacing 5 mm
Solder joint profiles for silver/nickel/tin terminations
B57164K
K164
1.3.3 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size A
B
C
inch/mm
0402/1005 0.6
0.6
1.7
0603/1608 1.0
1.0
3.0
0805/2012 1.3
1.2
3.4
1206/3216 1.8
1.2
4.5
1.3.4 Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 22 of 30