K164 Datasheet, PDF (19/30 Pages) Siemens Semiconductor Group – Temperaturmessung Bedrahtete Scheiben

Temperature measurement and compensation
Leaded NTC thermistors, lead spacing 5 mm
B57164K
K164
1.3.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Bath temperature (°C)
215 ±3
245 ±3
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Bath temperature (°C)
260 ±5
260 ±5
Dwell time (s)
3 ±0.3
3 ±0.3
Dwell time (s)
10 ±1
10 ±1
Please read Cautions and warnings and
Important notes at the end of this document.
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