K164 Datasheet, PDF (13/30 Pages) Siemens Semiconductor Group – Temperaturmessung Bedrahtete Scheiben

Temperature measurement and compensation
Leaded NTC thermistors, lead spacing 5 mm
1.3 Reel packing
B57164K
K164
Packing survey
Case Chip 8-mm tape
size thick-
ness³⁾
Reel dimensions
mm
mm
Blister Card- A
board
Tol. W1
0402 0.5
x
180 3/+0 8.4
0603 0.8
x
180 3/+0 8.4
330 ±2.0 12.4
0805 0.8 x
1.2 x
180 3/+0 8.4
330 ±2.0 12.4
1206 0.8 x
180 2/+0 8.4
1.2 x
180 2/+0 8.4
Packing units
Tol.
+1.5/0
+1.5/0
+1.5/0
+1.5/0
+1.5/0
+1.5/0
+1.5/0
W2
14.4 max.
14.4 max.
18.4 max.
14.4 max.
18.4 max.
14.4 max.
14.4 max.
pcs./reel
180-mm 330-mm
reel
reel
10000
4000

4000


16000
16000
3000 12000
4000 
2000 
2
Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
60
62
70
72
SMD
SMD
SMD
SMD
Cardboard tape
Blister tape
Cardboard tape
Blister tape
180-mm reel packing
180-mm reel packing
330-mm reel packing
330-mm reel packing
3) Chip thickness depends on the resistance value.
Please read Cautions and warnings and
Important notes at the end of this document.
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