CA04F2FT5AUD010G_12 Datasheet, PDF (20/30 Pages) EPCOS – Ceramic transient voltage suppressors

ESD/EMI filters
ESD/EMI filter series
B72862F1050S160
Good and poor solder joints caused by amount of solder in reflow soldering.
5
Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-
cially attractive method of component connection to supplement or even replace conventional sol-
dering methods.
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-
bedded. Electrical conduction is effected by contact between the metal particles.
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives
can be deposited ready for production requirements by screen printing, stamping or by dis-
pensers. As shown in the following table, conductive adhesion involves two work operations fewer
than soldering.
Reflow soldering
Screen-print solder paste
Wave soldering
Apply glue dot
Conductive adhesion
Screen-print conductive adhesive
Mount SMD
Predry solder paste
Reflow soldering
Wash
Inspect
Mount SMD
Cure glue
Wave soldering
Wash
Inspect
Mount SMD
Cure adhesive
Inspect
Please read Cautions and warnings and
Important notes at the end of this document.
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