CA04F2FT5AUD010G_12 Datasheet, PDF (18/30 Pages) EPCOS – Ceramic transient voltage suppressors

ESD/EMI filters
ESD/EMI filter series
B72862F1050S160
2.3 Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free
soldering processes only.
Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-
tions.
3
Recommended soldering methods - type-specific releases by EPCOS
3.1 Overview
Type
Case size
CT... / CD... 0201/ 0402
CT... / CD... 0603 ... 2220
CN...
0603 ... 2220
CN...K2
1812, 2220
Arrays
0405 ... 1012
ESD/EMI filters 0405, 0508
CU
3225, 4032
SHCV
-
Reflow soldering
SnPb
Lead-free
Approved
Approved
Approved
Approved
Approved
No
Approved
Approved
Approved
Approved
Approved
Approved
Approved
Approved
No
No
Wave soldering
SnPb
Lead-free
No
No
Approved
Approved
Approved
No
No
No
No
No
No
No
Approved
Approved
Approved
Approved
3.2 Nickel barrier and AgPt terminated multilayer CTVS
All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for lead-
free soldering. The nickel barrier layer is 100% matte tin-plated.
3.3 Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-
al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb
solder.
Note:
Lead-free soldering is not approved for MLVs with AgPd termination.
3.4 Silver-platinum terminated MLVs
The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free
with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is
recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is
recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
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