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EN2390QI Datasheet, PDF (4/21 Pages) Enpirion, Inc. – 9A Voltage Mode Synchronous Buck PWM
PIN
68
77
NAME
CGND
PGND
EN2390QI
I/O
FUNCTION
Connect to GND plane at all times.
Not a perimeter pin. Device thermal pad to be connected to the system GND
plane for heat-sinking purposes.
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating
conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
PARAMETER
Voltages on : PVIN, VOUT
Pin Voltages – AVINO, AVIN, ENABLE, POK, S_IN, S_OUT
Pin Voltages – VFB, SS, EAIN, RCLX, FADJ
SYMBOL
MIN
-0.5
2.5
-0.5
MAX
15
6.0
2.75
UNITS
V
V
V
PVIN Slew Rate
Storage Temperature Range
Maximum Operating Junction Temperature
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
ESD Rating (based on Human Body Model)
ESD Rating (based on CDM)
TSTG
TJ-ABS Max
0.3
3
-65
150
150
260
2000
500
V/ms
°C
°C
°C
V
V
Recommended Operating Conditions
Input Voltage Range
PARAMETER
AVIN: Controller Supply Voltage
Output Voltage Range (Note 1)
Output Current
Operating Ambient Temperature
Operating Junction Temperature
SYMBOL
PVIN
AVIN
VOUT
IOUT
TA
TJ
MIN
4.5
2.5
0.75
-40
-40
MAX
14
5.5
5
9
+85
+125
UNITS
V
V
V
A
°C
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Shutdown
TSD
160
°C
Thermal Shutdown Hysteresis
TSDH
35
°C
Thermal Resistance: Junction to Ambient (0 LFM) (Note 2)
θJA
15
°C/W
Thermal Resistance: Junction to Case (0 LFM)
θJC
1.5
°C/W
Note 1: RCLX resistor value may need to be raised for VOUT > VIN – 2.5V to increase current limit threshold.
Note 2: Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for
high thermal conductivity boards.
©Enpirion 2012 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 4