MA28155 Datasheet, PDF (17/20 Pages) Dynex Semiconductor – Radiation Hard Programmable Peripheral Interface

PACKAGE OUTLINES & PIN ASSIGNMENTS
Ref
A
A1
b
c
D
e
e1
H
Me
Z
W
XG405
Min.
-
0.38
0.35
0.20
-
-
-
4.71
-
-
-
Millimetres
Nom.
-
-
-
-
-
2.54 Typ.
15.24 Typ.
-
-
-
-
Max.
5.715
1.53
0.59
0.36
51.31
-
-
5.38
15.90
1.27
1.53
Min.
-
0.015
0.014
0.008
-
-
-
0.185
-
-
-
Inches
Nom.
-
-
-
-
-
0.100 Typ.
0.600 Typ.
-
-
-
-
Max.
0.225
0.060
0.023
0.014
2.020
-
-
0.212
0.626
0.050
0.060
D
20
1
MA28155
PA3 1
PA2 2
PA1 3
PA0 4
DSN 5
CSN 6
Vss 7
A1 8
A0 9
PC7 10
PC6 11
PC5 12
PC4 13
PC0 14
PC1 15
PC2 16
PC3 17
PB0 18
PB1 19
PB2 20
Top
View
40 PA4
39 PA5
38 PA6
37 PA7
36 RD/WN
35 RESET
34 D0
33 D1
32 D2
31 D3
30 D4
29 D5
28 D6
27 D7
26 Vdd
25 PB7
24 PB6
23 PB5
22 PB4
21 PB3
21
A
40
W
Seating Plane
M_E
A₁
H
C
e₁
e
b
Z
15°
Figure 19: 40-Lead Ceramic DIL (Solder Seal) - Package Style C
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