DS1556 Datasheet, PDF (18/20 Pages) Dallas Semiconductor – 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM

DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
PKG
DIM
A
B
C
D
E
F
G
DS1556P
MIN
0.920
0.980
—
0.052
0.048
0.015
0.025
INCHES
NOM
0.925
0.985
—
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE: DALLAS SEMICONDUCTOR RECOMMENDS THAT POWERCAP
MODULE BASES EXPERIENCE ONE PASS THROUGH SOLDER REFLOW
ORIENTED WITH THE LABEL SIDE UP (“LIVE-BUG”).
HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR APPLY THE
SOLDERING IRON TO LEADS FOR MORE THAN 3 SECONDS. TO SOLDER,
APPLY FLUX TO THE PAD, HEAT THE LEAD FRAME PAD, AND APPLY
SOLDER. TO REMOVE THE PART, APPLY FLUX, HEAT THE LEAD FRAME
PAD UNTIL THE SOLDER REFLOWS, AND USE A SOLDER WICK TO
REMOVE SOLDER.
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