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DS1743 Datasheet, PDF (15/17 Pages) Dallas Semiconductor – Y2KC Nonvolatile Timekeeping RAM
DS1743P
DS1743/DS1743P
NOTE:
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live-bug”).
Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux,
heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
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