DS1646 Datasheet, PDF (10/11 Pages) Dallas Semiconductor – Nonvolatile Timekeeping RAM

DS1646 32-PIN PACKAGE
DS1646P
DS1646/DS1646P
PKG
DIM
A IN.
MM
B IN.
MM
C IN.
MM
D IN.
MM
E IN.
MM
F IN.
MM
G IN.
MM
H IN.
MM
J IN.
MM
K IN.
MM
28-PIN
MIN MAX
1.670 1.690
38.42 38.93
0.715 0.740
18.16 18.80
0.335 0.365
8.51 9.27
0.075 0.105
1.91 2.67
0.015 0.030
0.38 0.76
0.140 0.180
3.56 4.57
0.090 0.110
2.29 2.79
0.590 0.630
14.99 16.00
0.010 0.018
0.25 0.45
0.015 0.025
0.38 0.64
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.980
-
0.052
0.048
0.015
0.025
INCHES
NOM
0.925
0.985
-
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
NOTE:
For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
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