MTB55N03KSN3 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – 30V N-Channel Enhancement Mode MOSFET

CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C122N3
Issued Date : 2015.07.22
Revised Date :
Page No. : 9/9
Marking:
Date Code
B5^T3^ES
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style: Pin 1.Gate 2.Source 3.Drain
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min.
Max.
A 0.900 1.150 0.035 0.045 E1 2.250 2.550
A1 0.000 0.100 0.000 0.004 e
0.950 TYP
A2 0.900 1.050 0.035 0.041 e1 1.800 2.000
b 0.300 0.500 0.012 0.020 L
0.550 REF
c 0.080 0.150 0.003 0.006 L1 0.300 0.500
D 2.800 3.000 0.110 0.118 θ
0°
8°
Inches
Min.
Max.
0.089 0.100
0.037 TYP
0.071 0.079
0.022 REF
0.012 0.020
0°
8°
E 1.200 1.400 0.047 0.055
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB55N03KSN3
CYStek Product Specification