MTB5D0P03FP Datasheet, PDF (8/8 Pages) Cystech Electonics Corp. – P-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
TO-220FP Dimension
Marking:
Spec. No. : C965FP
Issued Date : 2015.07.20
Revised Date : 2015.07.21
Page No. : 8/8
Device Name
Date Code
B5D0
P03
□□□□
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Gate 2.Drain 3.Source
*Typical
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A
0.171 0.183
4.35
4.65
G
0.246 0.258
6.25
6.55
A1
0.051 REF
1.300 REF
H
0.138 REF
3.50 REF
A2
0.112 0.124
2.85
3.15
H1
0.055 REF
1.40 REF
A3
0.102 0.110
2.60
2.80
H2 0.256 0.272 6.50
6.90
b
0.020 0.030
0.50
0.75
J
0.031 REF
0.80 REF
b1
0.031 0.041
0.80
1.05
K
0.020
0.50 REF
b2
0.047 REF
1.20 REF
L
1.102 1.118 28.00 28.40
c
0.020 0.030 0.500 0.750 L1 0.043 0.051 1.10
1.30
D
0.396 0.404 10.06 10.26 L2 0.036 0.043 0.92
1.08
E
0.583 0.598 14.80 15.20
M
0.067 REF
1.70 REF
e
0.100 *
2.54*
N
0.012 REF
0.30 REF
F
0.106 REF
2.70 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB5D0P03FP
CYStek Product Specification