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W40S11-02 Datasheet, PDF (8/11 Pages) Cypress Semiconductor – SDRAM Buffer - 2 DIMM (Mobile)
W40S11-02
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause per-
manent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specifi-
cation is not implied. Maximum conditions for extended peri-
ods may affect reliability.
Parameter
VDD, VIN
TSTG
TA
TB
Description
Voltage on any pin with respect to GND
Storage Temperature
Operating Temperature
Ambient Temperature under Bias
Rating
Unit
–0.5 to +7.0
V
–65 to +150
°C
0 to +70
°C
–55 to +125
°C
DC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V±5%
Parameter
Description
Test Condition/Comments
Min
Typ
IDD
3.3V Supply Current
at 66 MHz
120
IDD
3.3V Supply Current
at 100 MHz
185
IDD Tristate
3.3V Supply Current in
5
Three-State
Logic Inputs
VIL
Input Low Voltage
VIH
Input High Voltage
IILEAK
Input Leakage Current, BUF_IN
IILEAK
Input Leakage Current[3]
Logic Outputs (SDRAM0:9)[4]
VSS–0.3
2.0
–5
–20
VOL
Output Low Voltage
VOH
Output High Voltage
IOL
Output Low Current
IOH
Output High Current
Pin Capacitance/Inductance
IOL = 1 mA
IOH = –1 mA
VOL = 1.5V
VOH = 1.5V
3.1
70
110
65
100
CIN
Input Pin Capacitance
COUT
Output Pin Capacitance
LIN
Input Pin Inductance
Note:
3. OE, SDATA, and SCLOCK logic pins have a 250-kΩ internal pull-up resistor (VDD – 0.8V).
4. All SDRAM outputs loaded by 6" transmission lines with 22-pF capacitors on ends.
Max
Unit
160
mA
220
mA
10
mA
0.8
V
VDD+0.5
V
+5
µA
+5
µA
50
mV
V
185
mA
160
mA
5
pF
6
pF
7
nH
8