MB9B560R Datasheet, PDF (71/169 Pages) SPANSION – This document states the current technical specifications regarding

MB9B560R Series
Table for Package Thermal Resistance and Maximum Permissible Power
Package
Printed Circuit Board
Thermal Resistance
θja (°C/W)
Maximum Permissible Power
(mW)
Ta=+85 °C
Ta=+105 °C
FPT-80P-M37
Single-layered both sides
60
667
333
(0.5 mm pitch)
4 layers
39
1026
513
FPT-80P-M40
Single-layered both sides
58
690
335
(0.65 mm pitch)
4 layers
38
1053
526
FPT-100P-M23
Single-layered both sides
57
702
351
(0.5 mm pitch)
4 layers
38
1053
526
FPT-100P-M36
Single-layered both sides
48
833
417
(0.65 mm pitch)
4 layers
34
1177
588
FPT-120P-M37
Single-layered both sides
62
645
323
(0.5 mm pitch)
4 layers
43
930
465
BGA-112P-M05
Single-layered both sides
60
667
333
(0.5 mm pitch)
4 layers
40
1000
500
BGA-144P-M09
Single-layered both sides
55
727
364
(0.5 mm pitch)
4 layers
40
1000
500
WARNING:
1. The recommended operating conditions are required to ensure the normal operation of the semiconductor device. All of the
device's electrical characteristics are warranted when the device is operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device
failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you
are considering application under any conditions other than listed herein, please contact sales representatives beforehand.
Document Number: 002-04864 Rev.*A
Page 71 of 169