CY7C63221 Datasheet, PDF (48/50 Pages) Cypress Semiconductor – Low-speed USB Peripheral Controller

FOR
FOR
18-Lead (300-Mil) Molded SOIC S1
enCoRe™ USB
CY7C63221/31A
18-Lead (300-Mil) Molded DIP P3
51-85023-A
Die Step: 2031.0 x 2279.0 microns
Pad Size: 80 x 80 microns
DIE FORM
Cypress Logo
4
5
Y
6
15
14
(0,0)
13
X
51-85010-A
Document #: 38-08028 Rev. *B
Page 48 of 50
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