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BCM89071A1CUBXGT Datasheet, PDF (43/69 Pages) Cypress Semiconductor – Single-Chip Automotive Grade Bluetooth Transceiver and Baseband Processor
BCM89071 Data Sheet
Ball Grid Arrays
Section 8: Ball Grid Arrays
Figure 8 shows the top view of the 42-bump, 2.97 x 2.46 x 0.5 mm array.
Figure 8: 42-Bump 2.97 x 2.46 x 0.5 mm Array (Top View)
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A
B
C
D
E
F
Table 7: Ball-Out for the 42-Bump BCM89071A1KUBXG
1
2
A VSS
OTP_DIS
B N/C
VSS
C SPIM_CLK UART_TXD
D SDA
UART_RXD
E SCL
SPIM_CS_N
F VDDC
UART_RTS_N
3
VDDC
4
PCM_SYNC
GPIO_1
LPO_IN
GPIO_0
PCM_CLK
VDDO
PCM_IN
UART_CTS_N PCM_OUT
VSS
GPIO_5
5
VBAT
REG_EN
RST_N
GPIO_6
XOUT
XIN
6
VREGHV
VSS
TM2
RES
VSS
VSS
7
VREG
VDDTF
RFP
VSS
VDDRF
VDDPX
Broadcom®
April 16, 2015 • 89071-DS106-R
Baseband Transceiver and Baseband Processor
Page 42