IBIS4-1300_09 Datasheet, PDF (33/37 Pages) Cypress Semiconductor – 1.3 MPxl Rolling Shutter CMOS Image Sensor

IBIS4-1300
Package
84 pins ceramic LCC package (JLCC also available)
Standard 0.04 inch pitch outline
0.46" square cavity
Die thickness nominally 711 um +- 50um
Clearance from top of die to bottom of glass lid: 400um
nominally
Figure 28. Pin layout and package, top view
74
54
75
53
1169 ȝm
ADC
0,0
Diagonal stripe pattern
84
Pin1
Image sensor core
568ȝm
1280,1024
11
12
Cover glass
Size 18x18 mm for JLCC& LCC
Color sensor
Refractive index: 1,55
Thickness: 0,75+-0.05 mm
588ȝm
885ȝm
33
32
Material: BG39
This material acts a NIR cut-off filter. The transmission
characteristics are given in the figure below. The data used to
create the transmission curve of the BG39 material can be
obtained as an excel file upon simple request to
[e-mail].
Document Number: 38-05707 Rev. *B
Page 33 of 37