CYV15G0403TB Datasheet, PDF (20/21 Pages) Cypress Semiconductor – Independent Clock Quad HOTLink II™ Serializer

CYV15G0403TB
Ordering Information
Speed
Standard
Standard
Ordering Code
CYV15G0403TB-BGC
CYV15G0403TB-BGXC
Package
Name
BL256
BL256
Package Type
256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Operating
Range
Commercial
Commercial
Package Diagram
Figure 2. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
A1 CORNER I.D.
TOP VIEW
27.00±0.13
1.57±0.175
0.97 REF.
0.20(4X)
A
B
BOTTOM VIEW (BALL SIDE)
Ø0.15 M C
Ø0.30 M C
AB
Ø0.75±0.15(256X)
A
24.13
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
R 2.5 Max (4X)
H
J
K
L
M
N
P
R
T
U
V
W
Y
0.50 MIN.
A
A1 CORNER I.D.
0.15 C
0.60±0.10
C
SIDE VIEW
26°
0.15 C
TYP.
SEATING PLANE
0.20 MIN
TOP OF MOLD COMPOUND
TO TOP OF BALLS
SECTION A-A
51-85123-*E
HOTLink is a registered trademark and HOTLink II is a trademark of Cypress Semiconductor. All product and company names
mentioned in this document may be the trademarks of their respective holders.
Document #: 38-02104 Rev. *C
Page 20 of 21
© Cypress Semiconductor Corporation, 2002-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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