DS-72-34 Datasheet, PDF (15/18 Pages) Cymbet Corporation – I2C Real-Time Clock/Calendar with Integrated Backup Power

Preliminary
CBC34803 EnerChip™ RTC
SMT PROCESS
The EnerChip RTCs are packaged in standard surface mount packages. Refer to the solder paste material data
sheets for attachment of the package to a PCB using solder reflow processes. Ensure that the solder reflow
oven is programmed to the correct temperature profile prior to assembling the EnerChip RTC on the PCB.
REFLOW SOLDERING
• The maximum number of times an uncharged EnerChip RTC may be reflow soldered is three times.
• The surface temperature of the EnerChip RTC package must not exceed 240°C.
• The recommended solder reflow profile is shown in Figure 6 below; refer to the table for time and
temperature requirements. Whenever possible, use lower temperature solder reflow profiles.
TP
TL
Parameter
Soak temperature, min, TSMIN
Soak temperature, max, TSMAX
Soak time, max, tS
Max ramp-up rate (TL to TP)
Liquidous temperature, TL
Time tL maintained above TL
Max peak temperature, TP
Max time tP at peak temperature TP
Max ramp-down rate (TP to TL)
Time 25°C to peak temperature
Sn/Pb
100°C
150°C
2 min
3°C/sec
183°C
60-150 sec
220°C
20 sec
6°C/sec
6 min max
Pb-free
150°C
200°C
2 min
3°C/sec
217°C
60-150 sec
240°C
30 sec
6°C/sec
8 min max
Figure 6: EnerChip RTC Solder Reflow Profile and Specification Table
©2014-2015 Cymbet Corporation • Tel: [phone] • www.cymbet.com
DS-72-34 V.20

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