SM3 Datasheet, PDF (32/36 Pages) Connor-Winfield Corporation – ULTRA MINIATURE STRATUM 3 MODULE

Application Notes continued
Optional SM3/SM3E Dual Footprint
A dual footprint configuration may be used when designing a host circuit board containing the Connor Winfield SM3 or SM3E
modules. The smaller SM3 contains a subset of the signal pins found on the larger SM3E in locations which allow for a simple
dual footprint arrangement like the one shown in Figure 13.
LOS
LOL
M/S REF
REF1
REF2
REF3
REF4
TDI
TMS
TRST
BITS_CLK
M/S_OUT
OUTPUT1
VPP
REF5
REF6
SM3E
32
1
SM3
28
31
2
27
30
3
26
29
4
25
28
5
24
27
6
23
26
7
22
(TOP VIEW)
25
8
21
24
9
20
23
10
19
22
11
18
21
12
17
20
13
16
19
14
15
18
15
17
16
0.850"
1.100"
MASTER SELECT
SPI_INT
SPI_OUT
RESET
SPI_ENBL
Vcc
SPI_IN
SPI_CLK
GND
TCK
TDO
HOLD_GOOD
T1/E1
VPN
REF7
REF8
Figure 13
The modules shown in Figure 13 are arranged in a left-justified fashion. Notice that right justified or center justified (with an
additional column of SM3 pins) arrangements are also possible, depending on the designer's preference.
Placement of external components
1. Place series resistors (33 ohms) at the source of all reference inputs (SM3 Pins 4 - 7, SM3E Pins 4-7 & 15-18).
2. Place series resistors (33 ohms) at the source of SPI_IN and SPI_CLK inputs (SM3 Pins 21,22, SM3E Pins 25 & 26).
3. Place one .01uF and one 47-100uF capacitor at the input power pin (SM3 Pin 23, SM3E Pin 27).
4. One 4.7uF (25V) capacitor is required at the VPP pin (SM3 & SM3E Pin 14).
5. One 4.7uF (25V) capacitor is required at the VPN pin (SM3 Pin 15, SM3E Pin 19).
Be sure to consult Connor Winfield's respective datasheets for additional mechanical, electrical, footprint and keep-out information.
Data Sheet #: TM052 Page 32 of 36 Rev: 03 Date: 11/07/08
© Copyright 2008 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice