CPC7581_1 Datasheet, PDF (15/17 Pages) Clare, Inc. – Line Card Access Switch

3.2 Printed-Circuit Board Layout
3.2.1 SOIC
1.27
(0.050)
2.00
(0.079)
0.60
(0.024)
3.2.2 DFN
0.35
(0.014)
1.05
(0.041)
9.40
(0.370)
DIMENSIONS
mm
(inches)
5.80
(0.228)
0.80
(0.031)
DIMENSIONS
mm
(inches)
As the metallic pad on the bottom of the DFN package
is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area.
CPC7581
R05
www.clare.com
15