CM2009 Datasheet, PDF (6/6 Pages) California Micro Devices Corp – VGA Port Companion Circuit

Mechanical Details
QSOP Mechanical Specifications
CM2009 devices are packaged in 16-pin QSOP pack-
ages. Dimensions are presented below.
For complete information on the QSOP-16 package,
see the California Micro Devices QSOP Package Infor-
mation document.
PACKAGE DIMENSIONS
Package
QSOP (JEDEC name is SSOP)
Pins
16
Dimensions
Millimeters
Min
Max
Inches
Min
Max
A
1.35
1.75
0.053 0.069
A1
0.10
0.25
0.004 0.010
B
0.20
0.30
0.008 0.012
C
0.18
0.25
0.007 0.010
D
4.80
5.00
0.189 0.197
E
3.81
3.98
0.150 0.157
e
0.64 BSC
0.025 BSC
H
5.79
6.19
0.228 0.244
L
0.40
1.27
0.016 0.050
# per tube
100 pcs*
# per tape
and reel
2500 pcs
Controlling dimension: inches
* This is an approximate number which may vary.
CM2009
Mechanical Package Diagrams
TOP VIEW
D
16 15 14 13 12 11 10 9
H
E
Pin 1 Marking
1 2 3 4 5 6 78
SIDE VIEW
A
SEATING
A1
PLANE
B
e
END VIEW
C
L
Package Dimensions for QSOP-16
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: [phone] ▲ Fax: [phone] ▲ www.calmicro.com 08/12/04