SHC605 Datasheet, PDF (4/15 Pages) Burr-Brown (TI) – High-Speed Operational TRACK-AND-HOLD AMPLIFIER

PIN CONFIGURATION
U Package
+In 1
+V_S 2
+V_S 3
DGND 4
AGND 5
AGND 6
AGND 7
–In 8
SO-16
16 –V_S
15 –V_S
14 Lock
13 Lock
12 Hold
11 Thresh/Hold
10 Select
9 V_OUT
PIN DESCRIPTION
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SYMBOL
+In
+V_S
+V_S
DGND
AGND
AGND
AGND
–In
V_OUT
Select
Thresh/Hold
Hold
Lock
Lock
–V_S
–V_S
DESCRIPTION
Non-Inverting Input
+5V Supply
+5V Supply
Digital Ground
Analog Ground
Analog Ground
Analog Ground
Inverting Input
Output Voltage
+5V Selects TTL; –5V Selects ECL
Logic threshold for single-ended
operation or complement Hold input for
differential operation
True Hold input
Complement Lock Input
True Lock input; Locks SHC605 in
Hold-mode regardless of Hold/Hold Inputs
–5V Supply
–5V Supply
ABSOLUTE MAXIMUM RATINGS
Supply ............................................................................................. ±7VDC
Input Voltage Range ............................................................................ ±5V
Differential Input Voltage .................... ±5.5V (between +In and –In inputs)
Storage Temperature Range .......................................... –40°C to +125°C
Lead Temperature (soldering, SOIC 3s) ....................................... +260°C
Output Short Circuit to Ground (+25°C) ................. Continuous to Ground
Junction Temperture (T_j) ............................................................... +175°C
PACKAGE/ORDERING INFORMATION
PRODUCT
SHC605AU
PACKAGE
SO-16 Surface-Mount
PACKAGE
DRAWING
NUMBER⁽¹⁾
265
TEMPERATURE
RANGE
–40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
®
SHC605
4