CB037E0104JBA Datasheet, PDF (15/19 Pages) AVX Corporation – Film Chip Capacitors PEN DIELECTRIC – CB Series

Film Chip Capacitors
PEN DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below.
They are NOT suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature
Ramp-Up (Ts max to Tp)
Preheat
- Temperature Min (Ts min)
- Temperature Min (Ts max)
- Time (ts min to ts max)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak temperature (Tp)
Time within 5°C of peak
temperature (tp)
Ramp-Down
1206 to 1812
3°C / second max
150°C
200°C
180 sec. max
217°C
60 sec. max
250°C
10 sec.
6°C / sec.
2220 to 6054
3°C / second max
150°C
200°C
180 sec. max
217°C
75 sec. max
255°C
10 sec.
6°C / sec.
RECOMMENDED SOLDER PASTE THICKNESS
Tp
TL
Ts max
Ts min
Tp - 5ºC
tS
Ramp up
tp
tL
Ramp
down
0 30 60 90 120 150 180 210 240 270 300 330
Time (seconds)
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
For optimum solderability, the recommended soldering
paste thickness: 1206 to 2824 :150 to 200μm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
C
B
PAD DIMENSIONS: millimeters (inches)
Size Code Case Size
A
B
C
01
1206
1.30 (0.051) 1.30 (0.051) 2.20 (0.087)
02
1210
2.00 (0.079) 1.30 (0.051) 2.20 (0.087)
03
1812
3.00 (0.118) 1.50 (0.059) 3.50 (0.137)
04
2220
5.00 (0.195) 1.90 (0.075) 4.50 (0.178)
A
05
2824
6.00 (0.234) 2.50 (0.098) 5.70 (0.224)
16
4030
7.50 (0.295) 3.00 (0.118) 8.00 (0.315)
17
5040
11.2 (0.441) 3.50 (0.137) 10.3 (0.406)
18
6054
14.6 (0.575) 3.60 (0.147) 12.6 (0.496)
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type
Temperature cycling
Ambient Temperature /
Humidity Storage
High Temperature /
Humidity Storage
Ref. Spec.
JESD22-A104
Test Conditions
-55°C +85(+10/-0)°C air
5 to 10 minutes soak 3 cycles/hour
30+/-2°C - 60+/-3% RH -2000H
70+/-5°C - 93+3/-2% RH -1000H
Analysis
SEM x 1000
SEM x 1000
SEM x 1000
Results
Pass
Pass
Pass
34