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HCPL-0708-560E Datasheet, PDF (6/12 Pages) AVAGO TECHNOLOGIES LIMITED – High Speed CMOS Optocoupler
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)
Description
Symbol
HCPL-0708 Option 060
Units
Installation classification per DIN VDE 0110/1.89, Table 1
  for rated mains voltage ≤150 V rms
I-IV
  for rated mains voltage ≤300 V rms
I-III
  for rated mains voltage ≤450 V rms
Climatic Classification
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
VIORM
560
V peak
Input to Output Test Voltage, Method b†
  VIORM x 1.875 = VPR, 100% Production
  Test with tm = 1 sec, Partial Discharge < 5 pC
VPR
1050
V peak
Input to Output Test Voltage, Method a†
  VIORM x 1.5 = VPR, Type and Sample Test,
  tm = 60 sec, Partial Discharge < 5 pC
VPR
840
V peak
Highest Allowable Overvoltage†
(Transient Overvoltage, tini = 10 sec)
VIOTM
4000
V peak
Safety Limiting Values
  (Maximum values allowed in the event of a failure,
  also see Thermal Derating curve, Figure 11.)
   Case Temperature
TS
150
°C
   Input Current
   Output Power
IS,INPUT
150
mA
PS,OUTPUT
600
mW
Insulation Resistance at TS, V10 = 500 V
RIO
≥109
Ω
†Refer to the front of the optocoupler section of the Isolation and Control Component Designer’s Catalog, under Product Safety Regulations sec-
tion IEC/EN/DIN EN 60747-5-2, for a detailed description.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
Ambient Operating Temperature[1]
TA
–55
125
°C
–40
+100
°C
Supply Voltages
VDD
0
6
Volts
Output Voltage
VO
–0.5
VDD2 +0.5
Volts
Average Output Current
IO
2
mA
Average Forward Input Current
IF
20
mA
Lead Solder Temperature
260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile   
See Solder Reflow Temperature Profile Section
Figure
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
Symbol
Min.
Max.
Units
Figure
TA
–40
+100
°C
VDD
4.5
5.5
V
IF
10
16
mA
1, 2