HFBR-5961ALZ Datasheet, PDF (2/13 Pages) AVAGO TECHNOLOGIES LIMITED – Multimode Small Form Factor (SFF) Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector

Package
The overall package concept for the Avago transceiver
consists of three basic elements; the two optical subas-
semblies, an electrical subassembly, and the housing as
illustrated in the block diagram in Figure 1.
The package outline drawing and pin out are shown in
Figures 2 and 5.The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 5 DIP.The low profile of the Avago transceiver
design complies with the maximum height allowed for
the LC connector over the entire length of the package.
The optical subassemblies utilize a high-volume
assembly process together with low-cost lens elements
which result in a cost effective building block.
The electrical subassembly consists of a high volume
multilayer printed circuit board on which the ICs and
various surface mounted passive circuit elements are
attached.
The receiver section includes an internal shield for the
electrical and optical subassemblies to ensure high
immunity to external EMI fields.
The outer housing including the LC ports is molded
of filled nonconductive plastic to provide mechani-
cal strength.The solder posts of the Avago design are
isolated from the internal circuit of the transceiver.
The transceiver is attached to a printed circuit board
with the ten signal pins and the two solder posts which
exit the bottom of the housing.The two solder posts
provide the primary mechanical strength to withstand
the loads imposed on the transceiver by mating with
the LC connector fiber cables.
DATA OUT
DATA OUT
SIGNAL
DETECT
DATA IN
DATA IN
Figure 1. Block Diagram
RXSUPPLY
QUANTIZER IC
RXGROUND
TX GROUND
LED DRIVER IC
PIN PHOTODIODE
PRE-AMPLIFIER
SUBASSEMBLY
LED
OPTICAL
SUBASSEMBLY
LC
RECEPTACLE
TXSUPPLY