SAM3U Datasheet, PDF (54/59 Pages) ATMEL Corporation – AT91SAM ARM-based Flash MCU

Figure 13-3. 144-lead LQFP Package Drawing
Notes:
1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
54 SAM3U Series
6430ES–ATARM–22-Aug-11