PS-AT7909E Datasheet, PDF(4/20 Page) ATMEL Corporation – MICROCIRCUIT, DIGITAL, CMOS, MONOLITHIC SILICON SINGLE CHIP TELEMETRY AND TELECOMMAND AT7909E

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PS-AT7909E Datasheet, PDF (4/20 Pages) ATMEL Corporation – MICROCIRCUIT, DIGITAL, CMOS, MONOLITHIC SILICON SINGLE CHIP TELEMETRY AND TELECOMMAND AT7909E

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PS-AT7909E

Rev A

1 GENERAL

1.1 Scope

This specification details the ratings, physical and electrical characteristics, tests and inspection

data of the Single Chip telemetry and Telecommand named AT7909E. It also defines the specific

requirement for space and military applications with high reliability.

1.2 Identification

Description

AT7909EKA-MQ

AT7909EKA-SV

Case

Application

Flat pack 256 leads Military application

Flat pack 256 leads Space application

1.3 Absolute maximum ratings

Supply voltage range (VDD) ............................................. -0.5V to 4V dc

Input voltage range (VIN) ................................................. -0.5V dc to 6V dc

Input current per power pin ............................................. +/- 60 mA

Input current par signal pin ............................................. +/- 10 mA

Storage temperature ...................................................... -65Â°C to 150Â°C

Maximum junction temperature (TJ) ................................. 175Â°C

Lead temperature (soldering @ 1/16 in, 10 s)................... 300Â°C

Thermal resistance junction to case (Rjc) ....................... 3.5 K/W

1.4 Recommended operating conditions.

Supply voltage range (VDD) ............................................. 3 V dc to 3.6 V dc

Ambient operating temperature (TA) ................................ -55Â°C to 125Â°C

Storage temperature ...................................................... 30Â°C, 20 to 65% RH, dust free, original packing

1.5 Radiation features

Tested up to a total dose (dose rate 0.1 rad/s) ................. 100 kRads (Si)

1.6 Handling precautions

These components are susceptible to damage by electrostatic discharge. Therefore, suitable

precautions shall be employed for protection during all phases of manufacturing, testing, shipment and any

handling.

ESD............................................................................. >4000 V

APPLICABLE DOCUMENTS

MIL-PRF-38535 ...................................... Integrated Circuits, Manufacturing, General Specification for.

MIL-STD-883 ........................................ Test Method Standard Microcircuits.

In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence.

REQUIREMENTS

3.1 Design, construction, and physical dimensions.

The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and

herein.

Sheet 4 / 20

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