CC2530F32 Datasheet, PDF (3/31 Pages) Aplus Intergrated Circuits – A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications

CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Supply voltage
Voltage on any digital pin
Input RF level
Storage temperature range
ESD ⁽²⁾
All supply pins must have the same voltage
All pads, according to human-body model, JEDEC STD 22, method
A114
According to charged-device model, JEDEC STD 22, method C101
MIN
MAX UNIT
–0.3
3.9 V
–0.3 VDD + 0.3,
≤ 3.9
V
10 dBm
–40
125 °C
2 kV
500 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
Operating ambient temperature range, T_A
Operating supply voltage
MIN MAX UNIT
–40
125 °C
2
3.6 V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with T_A = 25°C and VDD = 3 V, unless otherwise noted.
Boldface limits apply over the entire operating range, T_A = –40°C to 125°C, VDD = 2 V to 3.6 V, and f_c = 2394 MHz to
2507 MHz.
PARAMETER
I_core Core current consumption
TEST CONDITIONS
Digital regulator on. 16-MHz RCOSC running. No radio,
crystals, or peripherals active.
Medium CPU activity: normal flash access⁽¹⁾, no RAM access
32-MHz XOSC running. No radio or peripherals active.
Medium CPU activity: normal flash access⁽¹⁾, no RAM access
32-MHz XOSC running, radio in RX mode, –50-dBm input
power, no peripherals active, CPU idle
32-MHz XOSC running, radio in RX mode at -100-dBm input
power (waiting for signal), no peripherals active, CPU idle
32-MHz XOSC running, radio in TX mode, 1-dBm output
power, no peripherals active, CPU idle
32-MHz XOSC running, radio in TX mode, 4.5-dBm output
power, no peripherals active, CPU idle
Power mode 1. Digital regulator on; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD
and sleep timer active; RAM and register retention
Power mode 2. Digital regulator off; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and
sleep timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
MIN TYP MAX UNIT
3.4
mA
6.5 8.9 mA
20.5
mA
24.3 29.6 mA
28.7
mA
33.5 39.6 mA
0.2 0.3 mA
1
2 µA
0.4
1 µA
(1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.
Copyright © 2009, Texas Instruments Incorporated
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Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256