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| TCS3400 Datasheet, PDF (28/35 Pages) ams AG – Single Device Integrated Optical Solution | |||
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TCS3400 â Soldering &Storage Information
Soldering & Storage
Information
Figure 38:
Solder Reflow Profile
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217 ºC (T1)
Time above 230 ºC (T2)
Time above Tpeak - 10 ºC (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
tsoak
t1
t2
t3
Tpeak
Device
2.5 ºC/s
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260 ºC
Max -5 ºC/s
Figure 39:
Solder Reflow Profile Graph
Tpeak
T3
T2
T1
NottoScale
Timeinseconds
Page 28
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t3
t2
ams Datasheet
[v1-01] 2016-Apr-13
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