TCS3400 Datasheet, PDF (26/35 Pages) ams AG – Single Device Integrated Optical Solution

Package Drawings & Markings
Figure 36:
IC Package Mechanical Drawing
TCS3400 − Package Drawings & Markings
7239,(:
“
 
3KRWRGLRGH
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9''
6&/
*1'
(1'9,(:
“

1RPLQDO
6,'(9,(:
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%277209,(:
3KRWRGLRGH
$FWLYH$UHD
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&/ RI6ROGHU&RQWDFWVDQG3KRWRGLRGH$FWLYH$UHD
1RWH
3,1
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&/ RI6ROGHU&RQWDFWV
&/ RI3KRWRGLRGH$FWLYH$UHD
;“
6'$
,17
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RoHS
Green
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is ±20 μm unless otherwise noted.
2. The die is centered within the package within a tolerance of ±75 μm.
3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is Copper Alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Page 26
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ams Datasheet
[v1-01] 2016-Apr-13