AMIS-720233 Datasheet, PDF (2/12 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-720233-B: Contact Image Sensor
Data Sheet
2.0 Bonding Pad Outputs Locations and Die Dimensions
Figure 2 shows image sensors die dimension and the bonding pad locations for the AMIS-720233-B sensor chip. The location is
referenced to the lower left corner of the die. Note RSTLV, bias pad is not used.
Figure 2: Bonding Pad and Chip Layout
AMI Semiconductor –May 06, M-20567-001
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