AMIS-720233 Datasheet, PDF (1/12 Pages) AMI SEMICONDUCTOR – Contact Image Sensor

AMIS-720233-B: Contact Image Sensor
Data Sheet
1.0 General Description
The AMIS-720233-B (PI3033B) contact image sensor (CIS) chip is a 200 dot per inch (dpi) resolution, linear array image sensor chip.
The sensor chip is processed with AMI Semiconductor’s proprietary CMOS image sensing technology. Designed for cascading multiple
chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in
varying sensing array lengths. This CIS chip offers image reading widths to suit document scanners found in facsimile, scanner, check
reader and office automation equipment.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing
switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 125um. The size of each chip without
scribe lines is 7950um by 500um. Each sensor chip has eight bonding pads. Only seven are used to make the CIS modules. The pad
symbols and functions are described in Table 1.
Buffer
SP
7950 m
Row of 64 Sensors
and Video Signal
Multiplexers
Readout Shift Register
500 m
Buffer
CP VDD DGND
Chip
Select
IOUT RSTLEV
Buffer
AGND EOS
Figure 1: AMIS-720233-B Block Diagram
Table 1: Pad Symbols and Functions
Symbol
Function
SP
Start pulse: input to start the line scan
CP
Clock pulse: input to clock the shift register
VDD
Positive supply: +5V supply connected to substrate
DGND
Digital ground: connection topside common
RSTLEV
A bias pad: not used, left floating
IOUT
Signal current output: output for video signal current
AGND
Analog ground: connection topside common
EOS
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor –May 06, M-20567-001
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